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PSP1028111

RF Package from Nuvotronics

RF Package, DC - 50 GHz, 5 mm x 5 mm,

Status: Standard | Data Sheet:

| RoHS Compliance:

Market-leading lowest loss, surface mount form factor package for die under 3 x 3mm up to 50 GHz

Cubic Nuvotronics presents a new state of the art Low Loss MMIC package. The PolyStrata® package complements integrated MMIC performance, with less than 0.3 dB insertion loss up to 50 GHz and 20 dB return loss. The package can be
surface mounted to a PCB using standard SMT processes. This increases the ease of manufacturing while maintaining superior performance in a smaller size compared to other packaging substrates.

Part Number: PSP1028111
Manufacturer: Nuvotronics
Product: Housing
Material: Copper
Max Frequency: 50 GHz
Max Die Size: 3 mm2
RF Pin Count: 2 Qty
DC Pin Count: 8 Qty
Length: 5 mm
Width: 5 mm
Height: 0.4 mm

Design and Application Notes for PolyStrata® Die Packages

General guidelines on how to assemble, handle, and store PolyStrata® Die Packages.

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Product Specifications For PSP1028111 RF Package

Part Number: PSP1028111 Manufacturer: Cubic Nuvotronics, Inc. Product Description: RF Package, DC - 50 GHz, 5 mm x 5 mm,

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Description	Units Per Format	Available

Description	Units Per Format	Available

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PSP1028111

RF Package from Nuvotronics

RF Package, DC - 50 GHz, 5 mm x 5 mm,

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PSP1028111

RF Package from Nuvotronics

RF Package, DC - 50 GHz, 5 mm x 5 mm,

Technical Inquiry Request for PSP1028111 RF Package

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