Cubic Nuvotronics presents a new state of the art Low Loss MMIC package. The
PolyStrata® package complements integrated MMIC performance, with less than
0.3 dB insertion loss up to 50 GHz and 20 dB return loss. The package can be
surface mounted to a PCB using standard SMT processes. This increases the
ease of manufacturing while maintaining superior performance in a smaller size
compared to other packaging substrates.
Part Number:
PSP1028112
|
Manufacturer:
Nuvotronics
|
Product:
Housing
|
Material:
Copper
|
Max Frequency:
50 GHz
|
Max Die Size:
2 mm2
|
RF Pin Count:
2 Qty
|
DC Pin Count:
6 Qty
|
Length:
4 mm
|
Width:
4 mm
|
Height:
0.4 mm
|
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Design and Application Notes for PolyStrata® Die Packages
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General guidelines on how to assemble, handle, and store PolyStrata® Die Packages. General guidelines on how to assemble, handle, and store PolyStrata® Die Packages. |
Description | Units Per Format | Available |
Description | Units Per Format | Available |