Cubic Nuvotronics presents a new state of the art Low Loss MMIC package. The
PolyStrata® package complements integrated MMIC performance, with less than
0.3 dB insertion loss up to 50 GHz and 20 dB return loss. The package can be
surface mounted to a PCB using standard SMT processes. This increases the
ease of manufacturing while maintaining superior performance in a smaller size
compared to other packaging substrates
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Part Number:
PSP1028113
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Manufacturer:
Nuvotronics
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Product:
Housing
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Material:
Copper
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Max Frequency:
50 GHz
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Max Die Size:
1 mm2
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RF Pin Count:
2 Qty
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DC Pin Count:
4 Qty
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Length:
3 mm
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Width:
3 mm
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Height:
0.4 mm
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Design and Application Notes for PolyStrata® Die Packages
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General guidelines on how to assemble, handle, and store PolyStrata® Die Packages. General guidelines on how to assemble, handle, and store PolyStrata® Die Packages. |
| Description | Units Per Format | Available |
| Description | Units Per Format | Available |