SFAP-15DB

SemiGen fixed attenuator pads feature precise resistor films and superior metallization resulting in consistent performance and reliability. Our advanced thin-film technology allows our parts to have full side wraps for surface mount or on-board installation. Gold bondable top side contacts for the input and output make these ideal for standard RF/microwave assembly techniques. The fixed attenuators comprise devices with nominal attenuation values of 0 to 30 dB (in 1 dB steps). These attenuators contain wraps that connect the topside ground to the backside metallization of each die.

These pads are optimized for coplanar waveguide or microstrip PCB and microwave module assemblies. Bond wire or ribbon is used to connect the input and output terminals to the transmission lines. Connection to ground is achieved through the topside wraps connecting to the bottom metalized surface. The size, ground wrap and process-controlled resistor values allow the user enhanced power handling and return loss.

Features:

• Power Handling 2W CW
• Flat Response from DC to 40 GHz
• Return Loss >18dB DC to 14 GHz
• Return Loss >16dB 15Ghz to 40 GHz
• Temp Stable TCR <100 PPM
• Chip Size .030" X .030" on most all designs
• Waffle or Tape and Reel Format Available